A Leader in Contract Manufacturing for Electronic Printed Circuit Board Assembly
A Leader in Contract Manufacturing for Electronic Printed Circuit Board Assembly
Accutron’s Quality Standards are an essential part of our success. Highly trained operators perform multiple in-process inspections to insure all customers specified standards are upheld. Dedication and commitment to maintaining the highest level of workmanship provide repeatability and consistency throughout our organization.
Kaizen and Lean Manufacturing practices serve as a foundation to form a well-disciplined approach to Accutron’s manufacturing process. Efficiency is critical to produce the most innovative products, with the latest in technology, in the least amount of time possible.
Laser barcoding of printed circuit boards for traceability
Nordson Dage X-ray Component Counter
High-resolution 3-D sensing technology inspects solder paste deposition to each PCB. Paste height, volume and area is the key for identifying solder joint reliability prior to component placement.
Screen Capture of High-Resolution 3-D Solder Paste Analysis
A custom reflow profile is generated for each assembly
Automated Optical Inspection (AOI) is performed on every placement by Nordson YESTECH's advanced color camera imaging technology, offering high-speed PCB inspection with exceptional defect coverage
Where technology advances to more complex components, all BGA and uBGA placements are inspected carefully with our Dage X-Ray system
High-Resolution Inspection Station
Nikon 60X Ultra High-Resolution Inspection Station
Web-Based Data Collection for Class III and Aerospace Requirements
Multiple In-Process Inspection Stations
Final Audit